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Connector for Memory StickTM
SCEC Series
ESD (electro-static discharge) protection model whose robust structure achieves high reliability.
For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module
Features
Improved operability from long ejection stroke (10mm) and clear click feel. 4 solder lug terminals are provided in the plate for secure mounting onto the PC board. Allows setting of media locking mechanism. Reflow solderable.
Applications
For compact audio equipment, personal digital assistants, desktop PCs and notebook PCs For home audio equipment (TVs, set top boxes and recorders) For digital camcorders, digital still cameras, and headphone players
Typical Specifications
Items Applicable media Mounting type Structure Mounting style Media ejection structure Operating temperature range Voltage proof Performance Insulation resistance Initial Contact resistance Initial Insertion and removal cycle
Standard mount Push-push type 20 60
Specifications
Memory StickTM Surface mounting type
500V AC 1minute 1,000M 40m min. max.
12,000cycles
Product Line
Media ejection structure
Push-push type
Mounting system
Standard mount
Features
Stand-off mm
0
Packing system
Tray
Product No.
With boss standard mouth
SCEC1B0100
36
Connector for Memory StickTM SCEC Series
Dimensions
Style With boss standard mouth
27.4 10.2 (5.525) 9-1.5 10-0.5 4 Frame terminals
Unit:mm
PC board mounting hole dimensions Viewed from the mounting face side
Center of #1-Pad
(11.675) 3.7 2-2.1
2-0.9
0.45
Pad 2.4 Pitch 9-1.5 Pad 10-0.9 Pad 8.6 2.4
9.3
17.5 15
Pad 2.4 )2.5 min.
For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM
#1
#10
2-o 1.6 ho les
)37.2 max. ( 17.5 29.85
Media full length(50)
40.9
24
24
(53.85)
2-3.2
2-3.2
Pad 4
Over stroke
(12.95)
6.6
1.5
22.5
(1.2)
(10)
Media outline Card center
(11.975)
Media eject stroke
Locked position Mounting datum plane
( Dimensions) no parts mounting area Media outline
Card center
1.95
Media width for media insertion Opening groove taper Opening groove taper 21.65 0.8 1
Guide bosses 2-0.9
C
0.
3
Full height 4.1
Mounting datum plane
(
)39.7 min.
32.6
Pad 4
6.6
(
Combine Type For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module
37
Small Memory Card Connectors
Soldering Conditions
Example of Reflow Soldering Condition Reference
1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 CA K or CC T . 3. Temperature profile Surface of products
For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type
240 (max.) Temperature (C ) 230 (min.) 200 180 150 100 Time (s) Pre-heating 90 30 sec. 10 sec.(max.)
Room temperature
Heating time
For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module
sec.
Cautions for using this product
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.
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